High-Precision Copper Alloy SFP Osfp Qsfp Cage Frame with Nickel Plating for Optical Transceivers Housing

Product Description

TECHNICAL SPECIFICATION TABLE
| Parameter | Specification |
| :--- | :--- |
| Product Type | SFP 1x1 Transceiver Cage Assembly |
| Material (Top & Bottom) | High-Performance Copper Alloy |
| Finish/Plating | Nickel (Ni) Plated Over All |
| Operating Temperature | -40°C to +85°C |
| Storage Temperature | -55°C to +105°C |
| Packaging Type | Tape & Reel (T&R) |
| Manufacturing Process | Precision Thin-Wall Die Casting / Stamping Hybrid |
| Shielding Efficiency | High-Grade EMI Protection |
| Mounting Configuration | Through-Hole / Press-Fit Pins |
| Compatibility | SFP MSA Compliant |

PRODUCT OVERVIEW
This high-precision SFP (Small Form-factor Pluggable) Cage is engineered for the demanding environments of modern data centers and telecommunication networks. Utilizing advanced copper alloy die-casting and precision engineering, this component provides the structural integrity and electromagnetic interference (EMI) shielding required for high-speed data transmission modules. The integrated top and bottom cage design ensures a secure mechanical fit for optical transceivers, facilitating seamless hot-swappable connectivity in switches, routers, and network interface cards.


TECHNICAL ADVANTAGES OF PRECISION CASTING
Our manufacturing process utilizes high-pressure precision casting to achieve ultra-thin wall thickness without sacrificing structural rigidity. This allows for optimal heat dissipation and space efficiency within high-density networking equipment. The process ensures high dimensional stability (CT4-CT6) and a superior surface finish that enhances the conductivity of the nickel plating, which is critical for reducing EMI leakage and ensuring long-term signal integrity.

MATERIAL CHARACTERISTICS AND PLATING
Constructed from premium Copper Alloy, this cage offers superior thermal conductivity compared to standard steel alternatives. The 'Nickel-Plated Over All' finish provides exceptional corrosion resistance and maintains a low-impedance electrical path for grounding. This material choice is specifically optimized to withstand the wide temperature fluctuations (-40°C to +85°C) typical of high-performance networking environments.

QUALITY CONTROL AND TESTING STANDARDS
To ensure zero-defect delivery, our facility employs rigorous inspection protocols. We utilize CMM (Coordinate Measuring Machines) for dimensional verification, X-Ray fluorescence for plating thickness consistency, and environmental stress screening. Every batch undergoes mechanical pull-out force testing and EMI shielding effectiveness verification to meet international telecommunication standards.

CUSTOMIZATION CAPABILITIES (OEM/ODM)
We offer full-scale customization for various port configurations (1xN, 2xN) and thermal management enhancements. Our engineering team provides end-to-end support from 3D CAD modeling and mold design to prototyping and mass production. Special surface treatments or alternative alloys can be specified based on unique shielding or thermal requirements.

PACKAGING AND EXPORT SHIPPING
Components are packaged using the Tape & Reel method (T&R) to support automated Pick-and-Place SMT assembly lines, reducing labor costs and improving production efficiency for our clients. Standard export cartons are moisture-sealed and reinforced to ensure protection during international transit.